8442.30.01.50/Single-Side Wafer Lapper/Japan

Single-Side Wafer Lapper from Japan

Single-side wafer lappers use loose abrasive slurries to achieve precise wafer thickness and flatness on one surface simultaneously. Essential for preparing wafers before final polishing. HTS 8442.30.0150 covers this as other preparation apparatus.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify lapping plate materials (tin, copper) and slurry composition in technical specs

• Include flatness specification capabilities (TTV <1μm)

• Document pressure control systems for uniform material removal