Single-Side Wafer Lapper from Germany

Single-side wafer lappers use loose abrasive slurries to achieve precise wafer thickness and flatness on one surface simultaneously. Essential for preparing wafers before final polishing. HTS 8442.30.0150 covers this as other preparation apparatus.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Specify lapping plate materials (tin, copper) and slurry composition in technical specs

Include flatness specification capabilities (TTV <1μm)

Document pressure control systems for uniform material removal

Single-Side Wafer Lapper from Germany — Import Duty Rate | HTS 8442.30.01.50