Semiconductor Wafer Grinder from Mexico
Precision wafer grinders use diamond wheels to back-grind semiconductor wafers to final target thickness (<50μm) after device processing. Maintains wafer strength for handling. Classified HTS 8442.30.0150 as grinding apparatus.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify grind wheel bond types (resin, metal) and grit sizes for surface finish
• Document wafer thickness measurement integration (in-situ metrology)
• Include tape frame handling specifications for temporary carrier systems