8442.30.01.50/Semiconductor Wafer Grinder/Japan

Semiconductor Wafer Grinder from Japan

Precision wafer grinders use diamond wheels to back-grind semiconductor wafers to final target thickness (<50μm) after device processing. Maintains wafer strength for handling. Classified HTS 8442.30.0150 as grinding apparatus.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify grind wheel bond types (resin, metal) and grit sizes for surface finish

• Document wafer thickness measurement integration (in-situ metrology)

• Include tape frame handling specifications for temporary carrier systems