Semiconductor Wafer Grinder from Germany
Precision wafer grinders use diamond wheels to back-grind semiconductor wafers to final target thickness (<50μm) after device processing. Maintains wafer strength for handling. Classified HTS 8442.30.0150 as grinding apparatus.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify grind wheel bond types (resin, metal) and grit sizes for surface finish
• Document wafer thickness measurement integration (in-situ metrology)
• Include tape frame handling specifications for temporary carrier systems