8442.30.01.50/Multi-Wafer Polishing Station/Japan

Multi-Wafer Polishing Station from Japan

Multi-wafer polishing stations process multiple semiconductor wafers simultaneously in carrier plates between upper/lower polishing pads. High-throughput final polish step. HTS 8442.30.0150 classification.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify throughput rates (wafers/hour) and batch sizes

• Include pad conditioning station integration

• Document cleanroom compatibility (Class 1 airflow)