Multi-Wafer Polishing Station from Japan
Multi-wafer polishing stations process multiple semiconductor wafers simultaneously in carrier plates between upper/lower polishing pads. High-throughput final polish step. HTS 8442.30.0150 classification.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify throughput rates (wafers/hour) and batch sizes
• Include pad conditioning station integration
• Document cleanroom compatibility (Class 1 airflow)