8442.30.01.50/Double-Side Wafer Polisher/Japan

Double-Side Wafer Polisher from Japan

Double-side wafer polishers simultaneously polish both wafer surfaces between rotating pads using chemical-mechanical planarization (CMP) slurries. Achieves mirror finish required for device fabrication. Under HTS 8442.30.0150 as other polishing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Detail polishing pad materials (polyurethane, felt) and slurry chemistry (colloidal silica)

• Provide carrier film specifications for 200mm/300mm wafers

• Include downforce control precision (<0.1psi)