8442.30.01.50/Double-Side Wafer Polisher/Germany

Double-Side Wafer Polisher from Germany

Double-side wafer polishers simultaneously polish both wafer surfaces between rotating pads using chemical-mechanical planarization (CMP) slurries. Achieves mirror finish required for device fabrication. Under HTS 8442.30.0150 as other polishing equipment.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Detail polishing pad materials (polyurethane, felt) and slurry chemistry (colloidal silica)

• Provide carrier film specifications for 200mm/300mm wafers

• Include downforce control precision (<0.1psi)

Double-Side Wafer Polisher from Germany — Import Duty Rate | HTS 8442.30.01.50