8442.30.01.50/Double-Side Wafer Polisher/Germany

Double-Side Wafer Polisher from Germany

Double-side wafer polishers simultaneously polish both wafer surfaces between rotating pads using chemical-mechanical planarization (CMP) slurries. Achieves mirror finish required for device fabrication. Under HTS 8442.30.0150 as other polishing equipment.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Detail polishing pad materials (polyurethane, felt) and slurry chemistry (colloidal silica)

• Provide carrier film specifications for 200mm/300mm wafers

• Include downforce control precision (<0.1psi)