Double-Side Wafer Polisher from Canada
Double-side wafer polishers simultaneously polish both wafer surfaces between rotating pads using chemical-mechanical planarization (CMP) slurries. Achieves mirror finish required for device fabrication. Under HTS 8442.30.0150 as other polishing equipment.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail polishing pad materials (polyurethane, felt) and slurry chemistry (colloidal silica)
• Provide carrier film specifications for 200mm/300mm wafers
• Include downforce control precision (<0.1psi)