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8442.30.01.50/CMP Wafer Polishing Tool/Japan

CMP Wafer Polishing Tool from Japan

Chemical Mechanical Planarization (CMP) tools polish semiconductor wafers using rotating pads and abrasive slurries to achieve atomic-level surface planarity. Essential for multi-layer device fabrication. HTS 8442.30.0150.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify pad types (stacked, embedded), conditioner disks, and slurry delivery

• Include endpoint detection systems (optical, eddy current)

• Document removal rate capabilities for different films (oxide, copper)

CMP Wafer Polishing Tool from Japan — Import Duty Rate | HTS 8442.30.01.50