boule Slicing Diamond Saw from Mexico
High-precision boule slicing diamond saws use inner-diameter blades to cut semiconductor ingots into wafers with minimal kerf loss (<100μm). Maintains crystal orientation integrity. HTS 8442.30.0150 as other sawing apparatus.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify blade specifications (ID/OD, diamond concentration, bond matrix)
• Include coolant flow rates and slurry composition details
• Document slicing yield targets (>95% prime wafers)