boule Slicing Diamond Saw from Japan
High-precision boule slicing diamond saws use inner-diameter blades to cut semiconductor ingots into wafers with minimal kerf loss (<100μm). Maintains crystal orientation integrity. HTS 8442.30.0150 as other sawing apparatus.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify blade specifications (ID/OD, diamond concentration, bond matrix)
• Include coolant flow rates and slurry composition details
• Document slicing yield targets (>95% prime wafers)