boule Slicing Diamond Saw from Germany
High-precision boule slicing diamond saws use inner-diameter blades to cut semiconductor ingots into wafers with minimal kerf loss (<100μm). Maintains crystal orientation integrity. HTS 8442.30.0150 as other sawing apparatus.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify blade specifications (ID/OD, diamond concentration, bond matrix)
• Include coolant flow rates and slurry composition details
• Document slicing yield targets (>95% prime wafers)