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8437.80.00/Wafer Slicing Diamond Saw/Mexico

Wafer Slicing Diamond Saw from Mexico

Wafer slicing diamond saws cut ultra-thin semiconductor wafers from monocrystalline boules with inner-diameter blades for precision kerf control. Classified in HTS 8437.80.00 as statistical note equipment for wafer preparation in semiconductor manufacturing. Maintains wafer integrity for subsequent processing steps.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Include blade specifications (diamond grit size, ID dimensions) in technical docs

• Certify saws meet semiconductor industry standards like SEMI S2 safety requirements

Wafer Slicing Diamond Saw from Mexico — Import Duty Rate | HTS 8437.80.00