Other machinery
Machines for cleaning, sorting or grading seed, grain or dried leguminous vegetables, and parts thereof; machinery used in the milling industry or for the working of cereals or dried leguminous vegetables, other than farm type machinery; parts thereof: > Other machinery
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8437.80.00
Grain Color Sorting Machine
Optical color sorting machines separate grain by color defects using high-speed cameras and pneumatic ejectors, improving quality for milling. Falls under HTS 8437.80.00 as machinery for working cereals other than farm-type. Essential for food processing plants before milling operations.
Semiconductor Wafer Grinder
Double-sided wafer grinders reduce semiconductor wafer thickness from both sides simultaneously to final target specs post-slicing. Per statistical notes, classified under HTS 8437.80.00 for wafer preparation equipment. Achieves parallelism and thickness uniformity for device processing.
Rice Whitening Abrasive Machine
Abrasive rice whitening machines polish brown rice by friction in rotating emery cones, removing bran layers for white rice. HTS 8437.80.00 includes cereal working machinery like rice milling equipment. Controls polishing degree for different rice varieties.
Wheat Bran Finisher
Bran finishers further reduce flour particles from wheat bran streams using impact and sieving after primary milling. Classified HTS 8437.80.00 as cereal milling machinery. Maximizes flour yield while maintaining bran quality for animal feed.
Czochralski Crystal Puller
A Czochralski crystal puller is used to produce extremely pure monocrystalline semiconductor boules from silicon melts, from which wafers are sliced for semiconductor fabrication. It falls under HTS 8437.80.00 as other machinery in the context of processing semiconductor materials, aligning with statistical notes for wafer manufacturing equipment. This machine employs the Czochralski method to grow high-purity crystals essential for the electronics industry.
Float Zone Crystal Grower
Float zone crystal growers produce monocrystalline silicon boules using the float zone method, ideal for high-purity semiconductor wafers. Classified under HTS 8437.80.00 as other machinery for semiconductor material processing per statistical notes. This equipment melts and recrystallizes polycrystalline silicon rods without crucibles.
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor crystal boules to required diameters and flats indicating conductivity type and resistivity. This wafer preparation equipment is covered under HTS 8437.80.00 per statistical notes for semiconductor processing machinery. Essential for preparing boules before wafer slicing.
Wafer Slicing Diamond Saw
Wafer slicing diamond saws cut ultra-thin semiconductor wafers from monocrystalline boules with inner-diameter blades for precision kerf control. Classified in HTS 8437.80.00 as statistical note equipment for wafer preparation in semiconductor manufacturing. Maintains wafer integrity for subsequent processing steps.
Semiconductor Wafer Lapper
Semiconductor wafer lappers use loose abrasives to achieve precise flatness and parallelism on wafer surfaces during preparation for fabrication. Falls under HTS 8437.80.00 as wafer preparation machinery per statistical notes. Critical for meeting tight dimensional tolerances before polishing.
Wafer Polishing Machine
Wafer polishing machines use chemical-mechanical planarization (CMP) with slurries to create mirror-finish semiconductor wafer surfaces. Classified under HTS 8437.80.00 as statistical note equipment for final wafer surface preparation. Achieves atomic-level flatness required for device fabrication.
Cereal Milling Roller Mill
Roller mills crush cereal grains between corrugated steel rollers to break endosperm from bran in flour milling processes. Classified under HTS 8437.80.00 as other milling industry machinery for cereals. Produces semolina, farina, and flour fractions through progressive grinding.
Dried Bean Grading Sieve
Vibratory sieves grade dried leguminous vegetables by size using interchangeable mesh screens before milling or packaging. Under HTS 8437.80.00 for machinery working dried leguminous vegetables. Ensures uniform sizing for processing consistency.
Flour Sifter and Bolter
Centrifugal bolting machines sift flour through silk/nylon bolting cloths, separating fine flour from bran particles in milling. HTS 8437.80.00 covers such cereal working machinery. Provides multi-stage sifting for various flour grades.
Pulse Milling Hammer Mill
Hammer mills for dried leguminous vegetables (pulses) use swinging hammers to dehusk and mill chickpeas, lentils into dhal flour. Under HTS 8437.80.00 for working dried leguminous vegetables. Includes aspiration systems for husk removal.
Semiconductor Crystal Ingot Grinder
Ingot grinders machine semiconductor crystals to precise diameters with orientation flats before slicing into wafers. Statistical notes place under HTS 8437.80.00 as crystal grinders for boule preparation. Creates reference flats indicating crystal orientation.