Wafer Slicing Diamond Saw from Japan
Wafer slicing diamond saws cut ultra-thin semiconductor wafers from monocrystalline boules with inner-diameter blades for precision kerf control. Classified in HTS 8437.80.00 as statistical note equipment for wafer preparation in semiconductor manufacturing. Maintains wafer integrity for subsequent processing steps.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include blade specifications (diamond grit size, ID dimensions) in technical docs
• Certify saws meet semiconductor industry standards like SEMI S2 safety requirements