Wafer Slicing Diamond Saw from China
Wafer slicing diamond saws cut ultra-thin semiconductor wafers from monocrystalline boules with inner-diameter blades for precision kerf control. Classified in HTS 8437.80.00 as statistical note equipment for wafer preparation in semiconductor manufacturing. Maintains wafer integrity for subsequent processing steps.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include blade specifications (diamond grit size, ID dimensions) in technical docs
• Certify saws meet semiconductor industry standards like SEMI S2 safety requirements