Wafer Polishing Machine from Japan
Wafer polishing machines use chemical-mechanical planarization (CMP) with slurries to create mirror-finish semiconductor wafer surfaces. Classified under HTS 8437.80.00 as statistical note equipment for final wafer surface preparation. Achieves atomic-level flatness required for device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Declare CMP slurry systems separately if modular for accurate valuation
• Provide SEMI-standard compliance certifications for polishing uniformity