Semiconductor Wafer Lapper from Mexico
Semiconductor wafer lappers use loose abrasives to achieve precise flatness and parallelism on wafer surfaces during preparation for fabrication. Falls under HTS 8437.80.00 as wafer preparation machinery per statistical notes. Critical for meeting tight dimensional tolerances before polishing.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify lapping plate materials (cast iron/tin) and abrasive slurry types in descriptions
• Include flatness specification capabilities (e.g
• <1 micron) for classification support