Semiconductor Wafer Lapper from Japan
Semiconductor wafer lappers use loose abrasives to achieve precise flatness and parallelism on wafer surfaces during preparation for fabrication. Falls under HTS 8437.80.00 as wafer preparation machinery per statistical notes. Critical for meeting tight dimensional tolerances before polishing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify lapping plate materials (cast iron/tin) and abrasive slurry types in descriptions
• Include flatness specification capabilities (e.g
• <1 micron) for classification support