Semiconductor Wafer Lapper from Canada
Semiconductor wafer lappers use loose abrasives to achieve precise flatness and parallelism on wafer surfaces during preparation for fabrication. Falls under HTS 8437.80.00 as wafer preparation machinery per statistical notes. Critical for meeting tight dimensional tolerances before polishing.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify lapping plate materials (cast iron/tin) and abrasive slurry types in descriptions
• Include flatness specification capabilities (e.g
• <1 micron) for classification support