Semiconductor Wafer Grinder from Mexico
Double-sided wafer grinders reduce semiconductor wafer thickness from both sides simultaneously to final target specs post-slicing. Per statistical notes, classified under HTS 8437.80.00 for wafer preparation equipment. Achieves parallelism and thickness uniformity for device processing.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify grind wheel types (diamond/CBN) and thickness control tolerances
• Provide wafer size range (4-12 inch) and material compatibility (Si/GaAs)
• Avoid general machine tool classification by documenting semiconductor specs