8437.80.00/Semiconductor Wafer Grinder/Japan

Semiconductor Wafer Grinder from Japan

Double-sided wafer grinders reduce semiconductor wafer thickness from both sides simultaneously to final target specs post-slicing. Per statistical notes, classified under HTS 8437.80.00 for wafer preparation equipment. Achieves parallelism and thickness uniformity for device processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify grind wheel types (diamond/CBN) and thickness control tolerances

• Provide wafer size range (4-12 inch) and material compatibility (Si/GaAs)

• Avoid general machine tool classification by documenting semiconductor specs