Semiconductor Wafer Grinder from Germany
Double-sided wafer grinders reduce semiconductor wafer thickness from both sides simultaneously to final target specs post-slicing. Per statistical notes, classified under HTS 8437.80.00 for wafer preparation equipment. Achieves parallelism and thickness uniformity for device processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify grind wheel types (diamond/CBN) and thickness control tolerances
• Provide wafer size range (4-12 inch) and material compatibility (Si/GaAs)
• Avoid general machine tool classification by documenting semiconductor specs