Semiconductor Wafer Grinder from Canada
Double-sided wafer grinders reduce semiconductor wafer thickness from both sides simultaneously to final target specs post-slicing. Per statistical notes, classified under HTS 8437.80.00 for wafer preparation equipment. Achieves parallelism and thickness uniformity for device processing.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify grind wheel types (diamond/CBN) and thickness control tolerances
• Provide wafer size range (4-12 inch) and material compatibility (Si/GaAs)
• Avoid general machine tool classification by documenting semiconductor specs