Crystal Boule Grinder from Japan
Crystal boule grinders precisely grind semiconductor crystal boules to required diameters and flats indicating conductivity type and resistivity. This wafer preparation equipment is covered under HTS 8437.80.00 per statistical notes for semiconductor processing machinery. Essential for preparing boules before wafer slicing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide material safety data sheets for diamond grinding wheels and coolants used
• Document precision tolerances (e.g
• flatness specs) to justify machinery classification