Wafer Grinder Coolant Manifold from Japan
Precision-machined manifold distributing deionized coolant to wafer grinding zone, preventing thermal damage. For semiconductor wafer grinders/polishers of heading 8430. Other parts 8431.49.90.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify DI water compatibility and flow rate per wafer size
• Documentation must link to specific grinder model
• Avoid classification as generic pipe fittings