Wafer Grinder Coolant Manifold from Canada
Precision-machined manifold distributing deionized coolant to wafer grinding zone, preventing thermal damage. For semiconductor wafer grinders/polishers of heading 8430. Other parts 8431.49.90.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify DI water compatibility and flow rate per wafer size
• Documentation must link to specific grinder model
• Avoid classification as generic pipe fittings