8431.49.90/Semiconductor Wafer Slicing Saw Spindle/Japan

Semiconductor Wafer Slicing Saw Spindle from Japan

High-speed air-bearing spindle for inner diameter wafer slicing saws, achieving kerf loss <20 microns per slice. Principal part for wafer slicing equipment under heading 8430. Other parts 8431.49.90.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify RPM (>30,000), kerf width, and coolant compatibility

• Pitfall: generic saw spindles under 8431.41

• Ensure diamond blade mounting specs provided

Semiconductor Wafer Slicing Saw Spindle from Japan — Import Duty Rate | HTS 8431.49.90