Semiconductor Wafer Slicing Saw Spindle from Germany
High-speed air-bearing spindle for inner diameter wafer slicing saws, achieving kerf loss <20 microns per slice. Principal part for wafer slicing equipment under heading 8430. Other parts 8431.49.90.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify RPM (>30,000), kerf width, and coolant compatibility
• Pitfall: generic saw spindles under 8431.41
• Ensure diamond blade mounting specs provided