Semiconductor Wafer Slicing Saw Spindle from Canada
High-speed air-bearing spindle for inner diameter wafer slicing saws, achieving kerf loss <20 microns per slice. Principal part for wafer slicing equipment under heading 8430. Other parts 8431.49.90.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify RPM (>30,000), kerf width, and coolant compatibility
• Pitfall: generic saw spindles under 8431.41
• Ensure diamond blade mounting specs provided