Semiconductor Wafer Slicing Diamond Saw Blade from Germany
Precision diamond-impregnated saw blade designed for slicing monocrystalline semiconductor boules into thin wafers. Suitable solely for wafer slicing saws in semiconductor manufacturing equipment of heading 8430. Classified in 8431.49.90 as other parts.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include wafer thickness tolerance specs (<50 microns) in documentation to prove semiconductor specificity
• Pitfall: generic saw blades may classify under 8202
• Ensure cleanroom compatibility certification