Semiconductor Wafer Slicing Diamond Saw Blade from Canada
Precision diamond-impregnated saw blade designed for slicing monocrystalline semiconductor boules into thin wafers. Suitable solely for wafer slicing saws in semiconductor manufacturing equipment of heading 8430. Classified in 8431.49.90 as other parts.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include wafer thickness tolerance specs (<50 microns) in documentation to prove semiconductor specificity
• Pitfall: generic saw blades may classify under 8202
• Ensure cleanroom compatibility certification