Semiconductor Wafer Lapper Conditioning Ring from Japan
Diamond pellet conditioning ring for dressing lapping plates to maintain uniform wafer removal rates. Used exclusively with semiconductor wafer lappers of heading 8430 equipment. 8431.49.90.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Pellet density and conditioning pressure specs mandatory
• Classify as machine part, not abrasive tool
• SEMI standard compliance documentation recommended