Semiconductor Wafer Lapper Conditioning Ring from Germany
Diamond pellet conditioning ring for dressing lapping plates to maintain uniform wafer removal rates. Used exclusively with semiconductor wafer lappers of heading 8430 equipment. 8431.49.90.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Pellet density and conditioning pressure specs mandatory
• Classify as machine part, not abrasive tool
• SEMI standard compliance documentation recommended