Crystal Boule Grinder Spindle Assembly from Japan
High-precision spindle with diamond grinding wheel mount for grinding semiconductor crystal boules to exact wafer diameters and flats indicating resistivity. Part of crystal grinder equipment for heading 8430 semiconductor machinery. Other parts under 8431.49.90.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide flat grinding tolerance data (microns) and boule diameter range specs
• Avoid classifying complete grinders under 8460; parts only
• Check for ITAR controls on precision components