Lapping Machine Slurry Distributor from Mexico
Ring distributor evenly applying abrasive slurry on lapping plates for semiconductor wafer flattening.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Slurry type compatibility docs; avoid general pump parts