Copper Bellows for Wafer Lapping Machine Vacuum Pump from Japan
Flexible copper alloy bellows for stroke motion in vacuum pumps of wafer lapping machines (8426). Provides contamination-free vacuum for maintaining wafer flatness in semiconductor prep. 8431.49.90.92 for copper parts of wafer processing equipment.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Cycle life and vacuum specs tailored to lapping prove principal use
• Cleanroom compatibility certification supports semiconductor classification