Copper Bellows for Wafer Lapping Machine Vacuum Pump from Japan
Flexible copper alloy bellows for stroke motion in vacuum pumps of wafer lapping machines (8426). Provides contamination-free vacuum for maintaining wafer flatness in semiconductor prep. 8431.49.90.92 for copper parts of wafer processing equipment.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Cycle life and vacuum specs tailored to lapping prove principal use
• Cleanroom compatibility certification supports semiconductor classification