Beryllium Copper Electrical Feedthrough for Wafer Grinder
Beryllium copper alloy feedthrough bushing for vacuum-sealed electrical connections in wafer grinding machines of heading 8426. Essential for powering grinders that prepare crystal boules to precise diameters in semiconductor manufacturing. Classified in 8431.49.90.92 for its copper alloy construction and use with 8426 machinery.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If insulated wire assembly rather than mechanical feedthrough
Insulated electrical conductors in Chapter 85; mechanical mounting parts stay in 8431.
If composed of other base metals like nickel alloys
Subheading .90.92 exclusive to copper/copper alloys; others in residual provisions.
If parts of semiconductor manufacturing machines not listed in 8425-8430
Unspecified semiconductor machines use 8473; prove 8426 applicability for 8431.
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Import Tips & Compliance
• Declare beryllium content explicitly; special handling notices may apply for hazardous material rules
• Pair with equipment blueprints showing feedthrough integration to confirm principal machinery use
Related Products under HTS 8431.49.90.92
Copper Heat Exchanger for Semiconductor Wafer Processing Chamber
A copper alloy heat exchanger designed specifically for temperature control in vacuum chambers of semiconductor wafer processing machinery under heading 8426. It facilitates precise thermal management during crystal growth and wafer fabrication processes. Classified under 8431.49.90.92 due to its construction from copper alloys and principal use with 8426 machinery for semiconductor manufacturing.
Copper Alloy Wafer Chuck for Crystal Puller
Precision-machined copper alloy chuck used to hold semiconductor wafers or boules in crystal growers and pullers (Czochralski method) under heading 8430. Its high thermal conductivity ensures uniform heating during monocrystalline silicon boule formation. Falls under 8431.49.90.92 as a copper alloy part principally for 8430 semiconductor machinery.
Copper Cooling Plate for Float Zone Crystal Furnace
High-purity copper cooling plate for heat dissipation in float zone crystal growers under heading 8430. Used to produce monocrystalline semiconductor boules like gallium arsenide via zone melting. HTS 8431.49.90.92 applies as copper part for 8430 semiconductor processing machinery.
Phosphor Bronze Bushings for Wafer Slicing Saw
Phosphor bronze (copper-tin alloy) precision bushings for spindle support in wafer slicing saws of heading 8426. Critical for maintaining alignment when slicing monocrystalline boules into wafers. Under 8431.49.90.92 as copper alloy parts for semiconductor wafer prep machinery.
Copper Alloy RF Window for Wafer Polisher Vacuum Chamber
Vacuum-tight copper alloy RF window for microwave coupling in wafer polishers and lappers (heading 8426). Enables plasma-assisted polishing for flat semiconductor wafer surfaces. 8431.49.90.92 for copper parts of semiconductor processing equipment.
Brass Manifold for Semiconductor Crystal Grinder Coolant System
Brass (copper-zinc alloy) distribution manifold for coolant delivery in crystal grinders (heading 8426). Distributes fluid to grind flats indicating conductivity on semiconductor boules. HTS 8431.49.90.92 as copper alloy part for 8426 machinery.