Wafer Slicing Saw Forged Steel Arbor from Japan
Forged steel arbor for wire or blade saws that slice semiconductor boules into wafers, as described in statistical note (a)(ii)(B) for heading 8426 machinery. It holds the cutting elements under extreme precision and vibration control. Classified in 8431.49.90.81 as a steel forging part for semiconductor wafer preparation equipment.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Submit slicing saw blueprints showing arbor integration to demonstrate 'solely or principally' use with wafer equipment
• Check for diamond wire compatibility declarations, as these prove semiconductor-specific application
• Avoid declaring as 'machine parts' generically; specify statistical note reference to prevent reclassification