Wafer Slicing Saw Forged Steel Arbor from Japan
Forged steel arbor for wire or blade saws that slice semiconductor boules into wafers, as described in statistical note (a)(ii)(B) for heading 8426 machinery. It holds the cutting elements under extreme precision and vibration control. Classified in 8431.49.90.81 as a steel forging part for semiconductor wafer preparation equipment.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit slicing saw blueprints showing arbor integration to demonstrate 'solely or principally' use with wafer equipment
• Check for diamond wire compatibility declarations, as these prove semiconductor-specific application
• Avoid declaring as 'machine parts' generically; specify statistical note reference to prevent reclassification