Wafer Grinder Main Drive Forged Steel Flange from Japan
Heavy-duty forged steel flange coupling the main drive spindle in wafer grinding machines for semiconductor processing under heading 8426. Ensures torque transmission for high-speed surface grinding to tight tolerances. 8431.49.90.81 classification for such steel forgings.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Include torque/load specs proving grinder application in semiconductor wafer flow
• Certify forging to AMS standards for high-purity environments
• Declare as unfinished forging to maintain 8431.49 status vs machined 8483 part