Wafer Grinder Main Drive Forged Steel Flange from China
Heavy-duty forged steel flange coupling the main drive spindle in wafer grinding machines for semiconductor processing under heading 8426. Ensures torque transmission for high-speed surface grinding to tight tolerances. 8431.49.90.81 classification for such steel forgings.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include torque/load specs proving grinder application in semiconductor wafer flow
• Certify forging to AMS standards for high-purity environments
• Declare as unfinished forging to maintain 8431.49 status vs machined 8483 part