Wafer Edge Grinder Forged Steel Chuck from Japan
Forged steel vacuum chuck securing wafers during edge grinding in semiconductor prep equipment of heading 8426. Achieves critical edge profiles for handling. Steel forging in 8431.49.90.81.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify vacuum port patterns matching wafer standards (SEMI specs)
• Document edge grind tolerance (<1 micron) for classification support
• Avoid finishing that triggers 8483 chuck classification