Wafer Edge Grinder Forged Steel Chuck from Japan
Forged steel vacuum chuck securing wafers during edge grinding in semiconductor prep equipment of heading 8426. Achieves critical edge profiles for handling. Steel forging in 8431.49.90.81.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Specify vacuum port patterns matching wafer standards (SEMI specs)
• Document edge grind tolerance (<1 micron) for classification support
• Avoid finishing that triggers 8483 chuck classification