Semiconductor Wafer Polisher Forged Steel Carrier Ring from Germany
Forged steel ring carrier that holds silicon wafers during chemical-mechanical polishing in heading 8426 equipment, ensuring edge protection and uniform pressure per statistical note (a)(ii)(C). Essential for mirror-finish wafer surfaces before device fabrication. HTS 8431.49.90.81 as steel forging part.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Provide CMP process compatibility data linking to wafer polishing statistical note
• Document ring hardness ratings for semiconductor slurry resistance
• Bundle with polisher machine docs if imported together to clarify part function