Semiconductor Wafer Polisher Forged Steel Carrier Ring from Germany
Forged steel ring carrier that holds silicon wafers during chemical-mechanical polishing in heading 8426 equipment, ensuring edge protection and uniform pressure per statistical note (a)(ii)(C). Essential for mirror-finish wafer surfaces before device fabrication. HTS 8431.49.90.81 as steel forging part.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide CMP process compatibility data linking to wafer polishing statistical note
• Document ring hardness ratings for semiconductor slurry resistance
• Bundle with polisher machine docs if imported together to clarify part function