Crystal Boule Grinder Forged Steel Spindle from Japan
This forged steel spindle is used in crystal grinders for semiconductor boules per statistical note (a)(ii)(A), part of heading 8426 wafer preparation machinery. It provides rotational precision for grinding boule diameter and flats indicating conductivity. HTS 8431.49.90.81 covers it as a steel forging specific to such equipment.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include resistivity flat grinding tolerance specs to tie to statistical note requirements
• Certify forging heat treatment for semiconductor cleanroom compatibility to support classification
• Pair with boule grinder import docs for set classification if applicable, avoiding individual part scrutiny