Wafer Thickness Gauging Sensor Mount from Japan
Aluminum precision mount that positions capacitive thickness sensors on wafer grinders (8429) for in-situ monitoring during semiconductor wafer thinning to ±0.5 micron tolerance. 8431.49.9020 attachment.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Sensor repeatability (±0.1μm) and grinder model compatibility docs
• Distinguish from chapter 90 instruments via mounting function
• Standalone sensor mounts may go to 9031