Wafer Thickness Gauging Sensor Mount from Japan
Aluminum precision mount that positions capacitive thickness sensors on wafer grinders (8429) for in-situ monitoring during semiconductor wafer thinning to ±0.5 micron tolerance. 8431.49.9020 attachment.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Sensor repeatability (±0.1μm) and grinder model compatibility docs
• Distinguish from chapter 90 instruments via mounting function
• Standalone sensor mounts may go to 9031