8431.49.90.20/Wafer Thickness Gauging Sensor Mount/Japan

Wafer Thickness Gauging Sensor Mount from Japan

Aluminum precision mount that positions capacitive thickness sensors on wafer grinders (8429) for in-situ monitoring during semiconductor wafer thinning to ±0.5 micron tolerance. 8431.49.9020 attachment.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Sensor repeatability (±0.1μm) and grinder model compatibility docs

• Distinguish from chapter 90 instruments via mounting function

• Standalone sensor mounts may go to 9031

Wafer Thickness Gauging Sensor Mount from Japan — Import Duty Rate | HTS 8431.49.90.20