Wafer Slicing Diamond Wire Guide from Japan
Precision ceramic or carbide guide attachment that mounts on wafer slicing saws (heading 8429) to tension and direct diamond-impregnated wire during kerfless slicing of silicon boules into wafers. Ensures uniform wafer thickness for semiconductor fabrication. Falls under 8431.49.9020 as an other mounting attachment.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document diamond wire compatibility and saw model numbers for binding ruling requests
• Use HTSUS explanatory notes references in entry summary to justify 8431 classification