Wafer Slicing Diamond Wire Guide from Japan
Precision ceramic or carbide guide attachment that mounts on wafer slicing saws (heading 8429) to tension and direct diamond-impregnated wire during kerfless slicing of silicon boules into wafers. Ensures uniform wafer thickness for semiconductor fabrication. Falls under 8431.49.9020 as an other mounting attachment.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document diamond wire compatibility and saw model numbers for binding ruling requests
• Use HTSUS explanatory notes references in entry summary to justify 8431 classification