Wafer Lapping Plate Mounting Fixture from Japan
Aluminum or stainless steel fixture that attaches lapping plates to wafer grinder/polisher machines (heading 8429) for achieving flatness tolerances on semiconductor wafers prior to fabrication. Ensures parallel mounting. Under 8431.49.9020 as other attachment.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify flatness specs (<1 micron) match statistical note requirements for chapter coverage
• Avoid 'lapping plate' standalone declarations; specify as complete mounting attachment