Wafer Lapping Plate Mounting Fixture from Germany
Aluminum or stainless steel fixture that attaches lapping plates to wafer grinder/polisher machines (heading 8429) for achieving flatness tolerances on semiconductor wafers prior to fabrication. Ensures parallel mounting. Under 8431.49.9020 as other attachment.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Certify flatness specs (<1 micron) match statistical note requirements for chapter coverage
• Avoid 'lapping plate' standalone declarations; specify as complete mounting attachment