Wafer Lapping Plate Mounting Fixture from Canada
Aluminum or stainless steel fixture that attaches lapping plates to wafer grinder/polisher machines (heading 8429) for achieving flatness tolerances on semiconductor wafers prior to fabrication. Ensures parallel mounting. Under 8431.49.9020 as other attachment.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Certify flatness specs (<1 micron) match statistical note requirements for chapter coverage
• Avoid 'lapping plate' standalone declarations; specify as complete mounting attachment